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Dgcon 2013 - Speakers

Mr. ADEE RAN, PHY architect, Communication & Storage Infrastructure Group, Intel Corporation
Lecture: IEEE 802.3bj – Technical Overview.


Adee Ran received the B.S degree in electrical engineering in 1991 and the M.S degree in electrical engineering in 2000, both from the Israel Institute of Technology (Technion). From 1991 to 2003 he was an R&D engineer at the Israel Defense Forces (IDF). In 2003 he joined Intel, where he works as a PHY architect for high-speed serial communication technologies, including Ethernet, PCI Express, and Thunderbolt. Adee is a senior member of the IEEE and an active contributor to the IEEE 802.3 Ethernet working group. He holds five U.S. patents and several others pending.

Mr. ARPAD MURANYI, IBIS Co-Founder, Mentor Graphics
Lecture: BIS Modeling – Comprehensive Overview and Recent Updates


Arpad Muranyi joined Intel Corporation in 1991 after graduating with a BSEE degree from California State University, Sacramento. He was one of the first employees of the Signal Integrity group in Folsom. His job assignments included SI simulations on numerous interfaces, such as the 33 MHz PCI bus interface for the PCISet products, 66 MHz GTL+ Front Side Bus for the 82440FX chip and the Pentium processor, 100 MHz SDRAM interface for the 82440BX, 266 MT/s HubLink interface, etc... He was one of the co-founders of the IBIS specification, and in his last few years at Intel Corporation, Arpad was involved with developing new behavioural I/O buffer modelling algorithms and methodologies for advanced buffers using the Verilog-AMS and VHDL-AMS modelling languages.
In 2007, Arpad joined Mentor Graphics where he continues his work with advanced modelling and simulation technologies for Mentor's leading edge signal integrity simulation products.

Mr. EYAL SHARON, Technology Specialist - High Speed Applications, Eastronics
Lecture: Interfacing to HMC II & DDR4 Memories


B.Sc ,Electrical Engineering (New Haven University, U.S.), MBA (Derby University, Israeli Branch).
1994 – 1999, Telrad Networks, Senior R&D Engineer, developing high speed digital H/W.
In 1999, Eyal joined ALTERA department at Eastronics and is currently as Senior Filed Application Engineer.
Over the past 6 years, Eyal has been focusing on consulting to Israeli hi-tech companies on high speed digital design applications
and High Speed Serial IOs implementations with ALTERA Programmable logic (FPGAs).

Mr. HAIM SPIEGEL, EDA RF Specialist, Agilent Technologies
Lecture: Advantages of 3D EM Tools in SI and PI Simulations.


Haim is the support and application Engineer for Agilent EEsof/ADS, EDA software in Israel. As an EEsof specialist, he is responsible for supporting and training engineers in the area of radio frequency and HSD. Haim teaches several ADS courses and has oriented many Engineers projects. Between 1998 and 2001, Haim served as a microwave designer at ELTA-IAI, leading projects in the area of microwave circuit design and developing innovative microwave technologies. Haim started his professional carrier working with analog control of power motors and electronic system for automatic train control.  He accumulated extensive experience in the area of radio frequency and microwaves. Haim’s technical areas of expertise include RF&MW circuits, HSD and systems, having a vast knowledge of electromagnetic simulation theory and CAD tools for RF&MW components, HSD, board and chip design.
Haim Spiegel holds a M.Sc degree from the Technion Israel, and a B.Sc. degree from the University Gama Filho, Brazil.

Mr. JACOV BRENER, Electromagnetics expert, Intel Corporation
Lecture: Copper surface roughness for close correlation between simulation and measurement in a 10Gbps package channelnel.


Jacov Brener received his B.A. degree in Physics in 2007 from the Technion, Haifa, Israel. While he was a student he joined Intel Corporation in 2005 and he continuesworking there today.
In 2006-2008 he served as a signal integrity engineer in an electrical validation group responsible for modeling, simulating and measuring high speed channels. In this position he consulted and solved various signal integrity issues, and
developed signal integrity solutions for electrical validation. From 2010 he worked as PHY package design engineer in charge for design, modeling, analysis, layout and measurements of package high-speed channels (signal integrity) and their PDN (power integrity) which are associated with a high-speed PHY.  These days he’s an electromagnetics design engineer responsible for on-silicon inductor design, package high-speed design and silicon-package-board signal/power integrity modeling and analysis for high-speed PHY's.
Jacov specializes  in electromagnetic simulations focusing on high-speed digital signal propagation in silicon-package-board domains.

Mr. LIAV BEN-ARTSI, Senior Signal Integrity Manager, Marvell Israel
Lecture: IEEE 802.3bj – Technical Overview. With Mr. Adee Ran


Liav Ben-Artsi holds a B.Sc. degree in Electrical Engineering from the Technion, Haifa, Israel.
Liav has worked in Marvell Israel for the last 13 years, most of these as a signal integrity engineer.
During his time working in Marvell he gained wide experience in signal integrity, high speed serial interfaces, high speed hardware board design, Serial interfaces electrical test plan definition and implementation, performed signal integrity board routing reviews, generated numerous board and package routing design guidelines, as well as Signal integrity trainings.
For the last two years he  has taken an active role in IEEE802.3bj (100Gbs Ethernet) standard committee.
He holds five U.S. patents and has several others pending.

Mr. BRIGHAM ASAY, High Performance Oscilloscope Expert, Agilent Technologies
Lecture: High Performance Scopes for Advanced Technologies.


Brig Asay manages product planning and strategic marketing for Agilent’s high performance oscilloscope business.
Brig joined Agilent Technologies in 2005 as a Technical Support Engineer. During his 8 years with Agilent, he has held the following positions: Marketing Operations Manager, where he oversaw the marketing budget and managed the technical support and learning products teams. Technical Support Engineer, which he helped solve numerous customer problems.
Prior to Agilent, Brig worked at Micron Technologies, Inc. as a Test Engineer. Brig graduated with an MBA from Northwest Nazarene University and a BSc in Electrical Engineering from the University of Wyoming. He is a published technical author.

Mr. DROR HAVIV, EMC Expert, Rafael
Lecture: Analysis of Single-Ended and Differential Striplines Crossing Split Reference Planes in PCBs.


Dror Haviv received his B.Sc degree in 2006 from the Institute of Technology, Holon, Israel and his M.Sc degree in 2009 from Ben-Gurion university, Be'er-Sheva, Israel. Both degrees are in Electrical Engineering, specializing in Electromagnetism and Microwaves. From 2010 to 2013 he served as signal/power integrity (SPI) engineer in the EMC group in Rafael.  His current roles are  R&D engineer and SPI simulations specialist in the electronics field in Rafael. His  roles involve high speed board design consulting, SPI researches, Electromagnetic and SPI simulations from board level to platform level and EMC engineering.

Mr. DUDI TASH, SI\PI Expert, Dgtronix
 Essential SI/PI considerations to design with contemporary High Speed Technologies.


Dudi started his practical Hardware Design Experience in 1991 in the IDF and Pegasus Technologies Ltd.
After graduating his degree in Electrical Engineering in 1997, he held various positions including Digital HW Engineer in Orckit Communications, Atrica (NSN), Senior HW Engineer in Silicom (part of the RAD Group), Flexlight Networks, and HW Director in Slyde Technologies.
Dudi founded Dgtronix in late 2007 and is the company CEO. Coupled with a strong technical and business background, he leads the Dgronix team with over two decades of hardware design and development experience.
His expertise includes digital high-speed board design, analog design, power supply design, signal/power integrity simulations, RTL design, regulatory design compliance and testing.
Dudi teaches advanced High-Speed Board Design since 2008. He holds a B.Sc.(te) in Electrical Engineering and an MBA, both from Tel Aviv University.

Mr. JOHN CALVIN, Measurement Technology Solutions Expert, Tektronix
Lecture: Testing & Measurement Challenges in 100Gb Technologies.


John is a Technology Solutions Marketing Manager at Tektronix where he has worked for the past 18 years, with a focus on high speed serial measurements solutions for industry standards including SATA, 100G/400G. John holds a Bachelor’s Degree in Electrical Engineering from Washington State University and has been awarded 6 patents in measurement-related technology.

Mr. PAOLO NOVELLINI, System I/O Specialist, Xilinx
Lecture: ERDES Interfaces and Signal Conditioning Principles for 28Gb and 100Gb Interfaces.


Paolo works today with major and strategic accounts at European level to define the architectures of high speed data links. His focus is in the Telecom area.
Paolo’s expertise is mainly in the PLL design, both analog and digital, for both clock recovery and synchronization.
Current interests are in the digital timing recovery of burst transmitted data signals (GPON) and the efficient fractional clock multiplication for network synchronization (SONET/SDH and Synchronous Ethernet).
Prior to joining Xilinx, Paolo was senior analog IC designer at Alcatel-Lucent and Infineon in both Italy and Germany.
He holds a Master degree in Microelectronics and Instrumentation from the Milan Polytechnic.

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